At CSAM Lab, we often explain to customers that Scanning Acoustic Microscopy (SAM) is just the beginning of the failure analysis journey. While SAM excels at non-destructive internal imaging, it often leads to a need for physical verification and deeper structural insight. That’s where cross-sectioning comes in. Cross-sectioning is one of the most powerful and […]

When electronic components fail—whether in the lab, in the field, or during production—accurately identifying the root cause is critical to improving reliability, preventing future issues, and meeting quality goals. Traditionally, electrical testing and physical inspection have been the go-to methods for failure analysis. But today, more and more engineers are turning to Scanning Acoustic Microscopy […]

At CSAM Lab, we specialize in Scanning Acoustic Microscopy (SAM) and Confocal Scanning Acoustic Microscopy (C-SAM™)—non-destructive imaging techniques that are essential tools in modern failure analysis workflows. Whether you’re dealing with semiconductor packages, PCB assemblies, or advanced electronic components, CSAM and SAM offer unparalleled insight into internal structural defects that would otherwise go unseen. What […]