At CSAM Lab, we specialize in Scanning Acoustic Microscopy (SAM) and Confocal Scanning Acoustic Microscopy (C-SAM™)—non-destructive imaging techniques that are essential tools in modern failure analysis workflows. Whether you’re dealing with semiconductor packages, PCB assemblies, or advanced electronic components, CSAM and SAM offer unparalleled insight into internal structural defects that would otherwise go unseen.
What is SAM and C-SAM?
Scanning Acoustic Microscopy (SAM) uses high-frequency ultrasound waves to scan the interior of a sample and detect variations in acoustic impedance. These variations reveal structural differences such as voids, cracks, delaminations, or inclusions. Confocal SAM (C-SAM™) adds additional resolution by focusing the acoustic beam in three dimensions, allowing for precise layer-specific imaging.
Both techniques are non-destructive, making them ideal for initial failure screening, quality assurance, and process validation—especially when device integrity must be preserved for further analysis.
Common Use Cases in Failure Analysis
SAM and C-SAM are routinely used to detect:
1. Delamination
Occurs when different material layers (e.g., die attach, mold compound, or lead frame) begin to separate. This is often due to thermal stress, humidity exposure, or manufacturing defects.
Example: In a plastic-packaged BGA (Ball Grid Array), delamination between the die attach and the substrate may indicate poor adhesion or moisture intrusion.
2. Voids
Air pockets or missing materials within the mold compound or underfill can degrade thermal performance or signal integrity.
Example: A void under the die in a power transistor package could lead to overheating and eventual thermal runaway.
3. Cracks and Die Fractures
Internal cracks in the silicon die or package materials can form due to mechanical stress, improper reflow soldering, or drop damage.
Example: A cracked die in a mobile device IC often results in intermittent functionality or outright failure.
4. Delamination from Moisture Sensitivity
Moisture-sensitive devices (MSDs) are particularly prone to internal blistering and delamination during reflow if not properly dried before soldering.
Example: A CSAM scan of a QFN device reveals popcorn cracking post-reflow—a telltale sign of trapped moisture expansion.
What Happens After CSAM?
Once a defect is detected via SAM or CSAM, the next step often involves cross-sectioning or mechanical delayering to precisely identify and localize the failure root cause.
Cross-Sectioning: The Physical Correlation
At CSAM Lab, we offer precision cross-sectioning services that expose the internal structure of the device for further optical, SEM, or EDS inspection. This step validates acoustic findings and enables in-depth material and process evaluation.
For example:
A SAM scan might reveal a suspected delamination under the die attach. Cross-sectioning confirms that the delamination occurred due to voided epoxy coverage during manufacturing.
Why Choose CSAM and SAM First?
- Non-Destructive: Preserves the device for further testing.
- Fast & Scalable: Ideal for high-volume inspections or batch screening.
- Layer-Specific Insight: Localizes internal anomalies without requiring disassembly.
- Cost-Effective: Prevents unnecessary destructive analysis on non-failing units.
Partner with CSAM Lab
At CSAM Lab, we’ve built our lab around the core belief that high-quality imaging and sample preparation are the foundation of effective failure analysis. Whether you’re screening for process defects, qualifying new packaging technologies, or chasing down elusive field failures, our SAM, C-SAM, and cross-sectioning services deliver the precision and reliability you need.